 METHOD FOR CONSTRUCTION OF A COMPONENT AND FOR FINISHING A SURFACE OF A COMPONENT OF AN ELECTRONIC D
专利摘要:
method for constructing a component and for finishing a surface of a component of an electronic device and component of an electronic device The invention is directed to providing a cosmetic finish on a component constructed by connecting several elements. a unique manufacturing process, such as machining or milling, can be applied to the bonded elements (610, 620, 630) to remove material from some or all of the elements (610, 620, 630) and to form a surface smooth and continuous through the interfaces between the individual elements of the component (600). in some cases, material removal process settings can be adjusted based on the material of the elements (610, 620, 630) of the components. for example, settings can be adjusted based on the fabrication or mechanical properties of each element material. 公开号:BR112012019273B1 申请号:R112012019273-6 申请日:2010-09-24 公开日:2021-06-15 发明作者:Scott Myers；Richard Heley；Matthew Theobald；Adam Stagnaro；Tang Tan；Richard Dinh；David Pakula 申请人:Apple Inc； IPC主号:
专利说明:
Cross Reference to Related Orders [0001] This application claims the benefit of U.S. Provisional Patent Application No. 61/300,780, filed on February 2, 2010; U.S. Provisional Patent Application No. 61/325,625, filed April 19, 2010, and U.S. Provisional Patent Application No. 61/325,786, filed April 19, 2010, all of which are incorporated herein by reference in their entirety. Background [0002] A portable electronic device can be built using different approaches. In some cases, an electronic device can be built by assembling several components together. Components can include external components that combine to form a device housing, as well as internal components that provide different functionality for the device. For example, an electronic device housing may include an integral component, or a component constructed from a single material (eg, a housing element). Such a component can provide substantial structural integrity as there may be no cracks or gaps that limit the component's resistance to applied external forces. [0003] In some cases, a component of an electronic device can be used as part of an electrical circuit. For example, one component can provide electrical functionality to another component of a device (for example, serving as a resistor or capacitor for a processor). As another example, a component could be part of an antenna assembly for an electronic device. If the component is used in only a single electrical circuit, the component can be constructed from a single piece of conductive material. If the same component, however, is used in several different electrical circuits, the component may have to be constructed from several conductive elements separated by a non-conductive or insulating element. For example, the first and second conductive elements can be connected together by an intermediate insulating element. [0004] The insulating element can be connected to the conductive elements of a component using any suitable approach. In some embodiments, the insulating element may extend beyond an interface between the insulating element and a conductive element as a result of the manufacturing process used to connect the conductive elements together via the insulating element. For example, a molded insulating element may include excess material that has seeped through a slit in a mold. When the multi-element component forms part of the electronic device casing, the excess material can impair a user's enjoyment of the device. For example, excess material can get into a user's hand or clothing. As another example, excess material can increase a user's likelihood of falling and breaking the electronic device. As another example, excess material can detract from the aesthetic appearance of the device. summary [0005] This is directed to the simultaneous processing of several different materials that form a single surface of an electronic device component to define a continuous surface of the component that spans an interface or gap between the different materials. In particular, this is directed towards providing a component constructed by combining several elements, and removing material from at least two of the various elements to provide a cosmetically pleasing continuous surface across the interfaces between the elements. The various elements can be formed from at least two different materials with different material properties. [0006] An electronic device component can be constructed connecting two elements together, using an intermediate element formed from a different material than that used for at least one of the two elements. For example, the two elements can be constructed from a conductive material (eg metal), while the intermediate element can be constructed from an insulating material (eg plastic). The materials used may have different properties, including, for example, different mechanical, fabrication, electrical, and thermal properties (for example, materials having different workmanship or mechanical stiffness). Different material properties may require different processes to cut or remove parts of materials including, for example, different tools, different configurations for a single tool, or different manufacturing processes (for example, different machines). [0007] To create an aesthetically pleasing component, and in particular to remove excess material from one or more of the elements to provide a continuous surface across an interface between adjacent component elements, one or more finishing processes may be applied to linked elements. In some cases, a single tool or process can be used to finish a surface that includes several elements constructed from different materials. For example, a single tool can be used for an entire component. As another example, a tool can be used for each of several distinct surfaces of a component (for example, surfaces in different planes). Because of the different material properties of the elements, however, the way in which the process or tool is applied (eg rotational speed, or application force) may vary depending on the element being processed. In some cases, the process can dynamically adjust settings based on the particular element being processed. In other cases, the process may apply settings that match a softer of several materials. [0008] Any suitable type of finishing process can be applied to a component. For example, a process can remove excess material, smooth out bumps, fill in valleys or holes, or perform any other operation necessary to provide a continuous, uniform surface across an interface between elements bonded together in the component. Such a process can include, for example, a polishing or grinding operation. When processing the post-assembly component (for example, once the individual elements have been bonded together), the resulting component may have continuous outer surfaces and even appear to be formed from a single piece of material, despite being the combination of several elements. By processing the component using a single tool or a single step, the component manufacturing process can be shortened. Brief Description of Drawings [0009] The above and other features of the present invention, its nature and various advantages will become more apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings, in which: Figure 1 is a schematic view of a member of the illustrative outer periphery constructed by connecting several elements together, in accordance with an embodiment of the invention; Figure 2 is a schematic view of a component of the illustrative electronic device in accordance with an embodiment of the invention; Figures 3A to 3C are schematic views tops of illustrative components, which include an intermediate element in accordance with some embodiments of the invention; Figure 4 is a schematic view of an illustrative component constructed from several elements having different material properties, in accordance with an embodiment of the invention; Figure 5 is a schematic view of an illustrative assembly for removing excess material from surfaces. Figure 6 is a schematic view of an illustrative assembly for removing excess material from a closed ring component according to an embodiment of the invention. Figure 6 is a schematic view of an illustrative assembly for removing excess material from a closed ring component. an embodiment of the invention; Figure 7 is a flowchart of an illustrative process for finishing a component constructed from elements of different materials, according to an embodiment of the invention, and Figure 8 is a flowchart of an illustrative process for adjusting configurations of a finishing apparatus in accordance with an embodiment of the invention. Detailed Description [00010] An electronic device may include several components assembled together to form the internal and external characteristics of the device. For example, one or more internal components (eg electrical circuits) can be placed within external components (eg a housing) to provide a device having the desired functionality. The different components can be manufactured by various means, including, for example, by assembling and connecting individual elements together. In some cases, an outer housing component can be constructed by assembling several elements together to form an integral component. [00011] Figure 1 is a schematic view of an illustrative outer periphery member constructed by connecting several elements together, according to an embodiment of the invention. Outer periphery member 100 can be constructed to form an outer surface of an electronic device. In particular, an outer periphery member 100 may wrap or wrap around some or all of the electronic components such that the outer periphery member 100 defines an inner volume in which the components of the electronic device can be placed. For example, an outer periphery member 100 may surround the entire device such that the outer surfaces 101 of the outer periphery member 100 define a left surface 102, a right surface 104, as well as an upper surface 106 and a lower surface 108 of the device. To provide a desired functionality to a user, the electronic device may include various components placed within the device, for example, within the inner volume of the outer periphery member. [00012] The thickness, length, height and cross section of the outer periphery element can be selected based on any suitable criteria, including, for example, based on structural requirements (eg, stiffness, or bending strength , compression, tension or twist in particular orientations). In some embodiments, the outer periphery member can serve as a structural element to which other components of the electronic device can be mounted. Some of the structural integrity of outer periphery member 100 may come from the closed shape it defines (e.g., an outer periphery member 100 that forms a ring). [00013] The outer periphery member 100 may have any suitable cross section. For example, an outer periphery member 100 may have a substantially rectangular cross section. In some embodiments, an outer periphery member 100 may instead or in addition have a cross-section of a different shape, including, for example, circular, oval, polygonal, or curved cross-section. In some embodiments, the shape or dimension of the cross-section may vary along the length or width of the device (for example, an hourglass-shaped cross-section). [00014] The outer periphery member of an electronic device can be constructed using any suitable process. In some embodiments, an outer periphery member 100 may be constructed by connecting element 110 and element 120 together at interface 112, connecting element 120 and element 130 together at interface 122, and connecting element 130 and element 110 together. together at interface 132. The elements may have any suitable shape, including, for example, large L-shaped element 110, small L-shaped element 120 and U-shaped element 130. Each element can be individually constructed and then assembled to form outer periphery member 100. For example, each element can be constructed using one or more of stamping, machining, working, casting, or combinations thereof. In some embodiments, materials selected for elements 110, 120 and 130 may be conductive to provide electrical functionality to the device (e.g., to serve as part of an antenna). [00015] To join the individual elements together, the intermediate elements 114, 124 and 134 can be placed within interfaces 112, 122, and 132 respectively. In some embodiments, each of the intermediate elements can be constructed from a material that can initially be provided in a first state where the material can flow between elements 110 and 120, elements 120 and 130, and elements 130 and 110 , when placed at interfaces 112, 122 and 132, respectively. The material may subsequently change to a second state in which the material connects elements 110 and 120, 120 and 130, and 130 and 110, respectively, together to form a single new component (e.g., an integral component ). [00016] Different approaches can be used to connect the elements of individual components together. For example, a connector, fastener, or other piece of mechanical connector can be connected to various component elements that are assembled together. A connector piece can be any suitable size in relation to the elements to be connected. In some cases, one or more portions of the connector piece may extend along a side surface of an element, or otherwise exceed a boundary defined by a cross-section of the elements (for example, when two elements are end-to-end connected to tip, such as the outer periphery member elements as described above in connection with Figure 1). In some cases, an adhesive can be used instead of or in addition to a fastener or mechanical connector. For example, a layer of adhesive can be placed between the components to be bonded. The adhesive layer can be provided using any suitable approach including, for example, as a liquid or paste adhesive, tape, heat-based adhesive, or a combination thereof. In some embodiments, an adhesive layer can have a reduced thickness or width (eg, reducing the space between elements) to ensure that the elements are bonded correctly. This can be due to the mechanical properties of the adhesive, as a thicker layer of the adhesive may have limited strength in bending, compression, peeling, tension, or several of these. [00017] While these approaches can be effective for elements coupled together, they may also require the profile of a component to increase (eg, beyond the cross section of the elements to be connected) or may limit the width or size of the connector (eg allow only one layer of film between elements). In addition, some of these approaches may require individual elements to be precisely manufactured (eg to high tolerances) to ensure that the resulting component is also manufactured to high tolerances. Figure 2 is a schematic view of a component of the illustrative electronic device according to an embodiment of the invention. Component 200 can be constructed from first element 210 and second element 212, which can be connected via element 220. [00018] The first and second elements 210 and 212 can be constructed from any suitable materials, including, for example, the same or different materials. For example, the first and second elements 210 and 212 can be constructed from one or more of a metal, plastic, a composite material, an organic material, or combinations thereof. In some cases, one or both elements may be constructed from conductive materials (and thus be used as part of the circuitry inside the device), but may need to be electrically isolated from each other for the proper functioning of the device circuitry. In such cases, the intermediate element may be constructed from an insulating material or dielectric to prevent an electrical signal from crossing the gap between the first element 210 and the second element 212. In some embodiments, the connecting element may be constructed to from a combination of conductive and insulating materials, where the insulating materials are arranged between the conductive materials. Alternatively, one or more conductive materials can be incorporated within the insulating materials. [00019] The individual elements of the component can be positioned using any suitable approach. For example, individual elements can be aligned in such a way that the cross sections of each element are aligned with each other (for example, the elements do not overlap). As another example, the individual elements can be positioned relative to one another such that the cross-section of the portions of the intermediate element 220 at the interfaces with the first and second elements do not extend beyond the cross-sections of the first and second elements at the interfaces. [00020] Intermediate element 220 can be any suitable size. For example, the intermediate element 220 may have any suitable length (e.g., defining the distance between the first and second elements 210 and 212), including a length that is substantially the same size or greater than the length associated with one or both of the first and second elements 210 and 212. Alternatively, the length of the intermediate element 220 may be less than a length associated with one or both of the first and second elements 210 and 212 (e.g., but at least 0.25 mm , such as 0.5mm or 1mm). In some embodiments, the length or shape of the intermediate element 220 can be selected based on the mechanical properties of the material of the intermediate element. For example, the intermediate element may include a variable width or cross section in the region between the elements. [00021] In some embodiments, the size or shape of the intermediate element 220 may vary between different components. For example, some or all of the first and second elements 210 and 212 can be constructed with relatively low tolerance, such that the length of the arms or portions of the first and second elements that are brought into contact with the intermediate element can vary. In particular, the first and second elements 210 and 212 can be initially manufactured to lower tolerances, and then positioned in a fixture with higher tolerances. Intermediate element 220 can be placed between the first and second elements. The material and process used to connect the intermediate element 220 between the first and second elements 210 and 212 can be selected such that the material can be supplied initially in a first state in which the material can fill the gap or space, or extend the interface between the first and second elements. For example, the material can be supplied as a liquid or a moldable solid (eg a soft clayey state) such that the material can be molded into an intermediate element. In some embodiments, the device can define boundaries and characteristics (eg, protrusions or constraints) within the surfaces of the intermediate element. [00022] Once properly positioned between the first and second elements (for example, filling the gap between the elements), the material of the intermediate element can change to a second state where the material adheres to both the first and second elements to provide a structurally solid bond (eg a mechanical bond) between them (eg the intermediate element is integrated between the first and second elements). For example, the material can harden and provide structural integrity between the first and second elements. Because the material can flow at any interval between the first and second elements, while in the first state, the material can absorb or eliminate variations in the manufacture of the first and second materials, due to the low manufacturing tolerances of these elements, while ensuring that the resulting component is built to a higher precision than its individual components. [00023] This approach can also reduce the complexity and detail needed to build the first and second elements. In particular, because the material of the intermediate element can flow in the first state, the material can flow around and in features of each of the first and second elements (as described below) to ensure that the material is tightly coupled to each of the first. and second elements. Furthermore, this approach can be tolerant of faults and other fabrication artifacts along the exposed surface of each of the first and second elements. In fact, the opposing surfaces of the first and second elements may not need to have corresponding characteristics, as the opposing surfaces of the first and second elements may not envelop, or need to be placed in close proximity (for example, as would otherwise be required with a adhesive). Instead, the material injected into the mold can flow around the features, and accommodate any displacements or misalignments of the features. [00024] Any suitable process can be used to supply the intermediate element material between the first and second elements, and to change the material state from the first state to the second state. In some embodiments, a molding process whereby a material is initially inserted in a liquid state and which subsequently hardens can be used. For example, one or more of the processes of injection molding, compression molding, transfer molding, extrusion molding, blow molding, thermoforming, or vacuum forming, or rotational molding can be used. Using a molding process, material can flow around the first and second elements 210 and 212, and the material can accommodate irregularities and defects in the elements, while subsequently changing state to provide structural integrity and define an integral component with high degree of tolerance. [00025] In some embodiments, a brazing process may be used instead of or in addition to a molding process. For example, a dielectric composite material can be welded between the first and second elements. In one implementation, a composite material can be placed in a fastening device between the first and second elements to be connected together, and the composite material can be heated so as to melt and fill a region between the conductive elements (e.g., is distributed between the conductive elements by capillary action and moisture). For example, the fixture and the composite material can be brought into contact with a heated surface, causing the composite material to heat and flow. The composite material can be cooled once it has filled the region between the conductive elements, forming a secure bond between the composite material and each of the conductive elements. Any suitable type of brazing can be used, including, for example, torch brazing, furnace brazing, brazing brazing, vacuum brazing, or dip brazing. The filler material may include any suitable composite material, including in particular various dielectric or insulating composite materials such as, for example, plastic, rubber, organic composite materials, non-conductive metal alloy, or combinations thereof. In addition, feature geometry along the inner surfaces of the conductive elements can be selected and designed to improve the weld bond. [00026] The elements connected by the intermediate element may include any suitable feature to improve adhesion between the elements and the intermediate element. Figures 3A to 3C are schematic top views of illustrative components including an intermediate element in accordance with some embodiment of the invention. The components shown in Figures 3A to 3C include first and second elements connected together by an intermediate element. The first and second elements can include any suitable feature to improve the connection with the intermediate element. In some embodiments, the elements may include one or more internal features that provide a locking interface, or that increase the surface area required for adhesion of the intermediate element to the first and second elements. For example, an element may include an internal curved feature (e.g., a spherical or cylindrical recess or protrusion) into or around which the material of the intermediate element may extend, thereby increasing the force based on surface tension. As another example, an element may include a feature of having one or more openings, holes, hooks, or other attributes that may engage a corresponding feature of the intermediate element, once the intermediate element has transitioned to the second state (eg, a hole on the first element where a post of the intermediate element can extend). In some embodiments, a feature may include a locking attribute, such as, for example, a recessed edge at or near the interface between a recessed feature or a raised feature, such that the recessed end, which forms a hook on that the material of the intermediate element can flow. [00027] The component 300 shown in Figure 3A can be constructed by connecting the first element 302 and the second element 304, using the intermediate element 306. To improve adhesion between the first element 302 and intermediate element 306, the first element 302 may include opening 308 within the body of the first element which is accessible from the surface of the first element which is in contact with intermediate element 306 by channels 309. Likewise, second element 304 may include opening 310 within of the body of the second element 304, which is accessible from the surface of the first element that is in contact with the intermediate element 306 by the channels 311. The opening and the channel can be any convenient size or shape including, for example, a selected shape. such that the channel is smaller than the opening. This can ensure that material from the intermediate element 306 flowing into the opening cannot pass back through the channel, and thus improves the retention of the intermediate element (for example, the through hole or opening forms a recess or blockage ). The opening can have any suitable shape, including, for example, a curved or angular cross-section, or a variable cross-section. The opening may extend through some or all of the first or second element, including, for example, through only an inner portion of the element (for example, to prevent the material of the intermediate element from extending into the opening to be exposed to an outer surface of the element). [00028] The component 320 shown in Figure 3B can be constructed by connecting the first and second elements 322 and 324 using the intermediate element 326. To improve the adhesion of the intermediate element 326 to the first and second elements, the intermediate element 326 can include portions of overflow 328 that extend beyond the cross-section of the first and second elements, which come into contact with the exposed surfaces of the first and second elements (e.g., surfaces other than the interface surfaces that oppose each other within the component ). The overflow portions 328 may extend over the entire appropriate surface of the first and second elements including, for example, only over one or more of an upper, lower, front or back surface, and/or along only one of the first and second elements, or various combinations thereof. [00029] The component 340 shown in Figure 3C can be constructed connecting the first and second elements 342 and 344, using the intermediate element 346. The first and second elements 342 and 346 can include the openings 348 and 330, and the channels 349 and 331 , respectively, as described above, in connection with component 300. To allow openings 348 and 330 to extend through the entire height of the first and second components, while maintaining uniform and consistent outer surfaces of the elements, the first and second elements may include chamfers 343 and 345, respectively, which extend from a surface of one of the elements. For example, the chamfers can extend from an inner surface of one of the elements such that the chamfers extend within an inner volume of a device that includes the component. The chamfer can be any suitable height, including, for example, a height that matches that of the main body of each element, or a height that is less than that of the main body. In particular, the chamfers can be set back with respect to upper and lower surfaces of the first and second elements. Apertures 348 and 330 may extend through the chamfers instead of or in addition to the main bodies of the elements. [00030] As a result of the manufacturing process, however, the interface between the elements and the materials used to connect the elements (eg, the material of the intermediate element) may be discontinuous, or include excess material. For example, as material is injected into a mold as part of a molding process, excess material may flow through the mold slits and extend beyond the boundaries of an interface between the intermediate element and a of the first and second elements. As another example, the material can curl or deform as it cools or heats up during the bonding process (for example, when the material changes from the first state to the second state). The resulting component can have a uniform interface between different materials. Figure 4 is a schematic view of an illustrative component constructed from several elements with different material properties, in accordance with an embodiment of the invention. Component 400 can be constructed of first and second connecting elements 410 and 412 using intermediate element 420. [00031] The first and second elements 410 and 412, and the intermediate element 420 can be constructed from any suitable material, including, for example, at least two different materials. For example, first and second elements 410 and 412 can be constructed from a first material, and intermediate element 420 can be constructed from a second material. Selected materials can have different mechanical properties including, for example, different modulus of elasticity, tensile strength, compressive strength, wear resistance, flow resistance, ductility, toxic ratio, or combinations of these. In some embodiments, materials may instead or in addition have different electrical, chemical, thermal, magnetic, optical, acoustic, radiological, or manufacturing properties (eg, machining speeds and feeds, machinability intervals, hardness, extrusion or molding temperature and pressure, or fusibility). For example, the first and second elements can be constructed from harder materials (or softer materials), and the intermediate element can be constructed from a softer material (or a harder material). As another example, the first and second elements can be constructed from conductive materials, and the intermediate element can be constructed from an insulating material. As yet another example, the first element can be constructed from a thermally conductive material, and the second and intermediate element can be constructed from thermal insulating materials. [00032] The manufacturing process used to connect the first and second elements 410 and 412 using the intermediate element 420 can cause excess material to extend beyond the desired boundaries or interfaces between the elements (for example, a boundary according to outer surfaces of first and second elements 410 and 412 such that regions of intermediate element 420 located in proximity to an interface with first element 410 and second element 412 fit within the cross section of first and second elements 410 and 412, respectively). In particular, an intermediate molded element 420 may include unwanted excess material (e.g. gloss) around the interfaces between the first element and an intermediate element 420, and between the second element 412 and the intermediate element 420. For example , intermediate element 420 may include excess material 421 and 422 along lower and upper surfaces of the element, and material 423 along a left surface of the element. Excess material may extend beyond the boundaries of one or more surfaces of the component, including, for example, around all external surfaces of the component (for example, around the internal, external, top and bottom surfaces of a member of the outer periphery, as shown in Figure 1). Materials that exceed the final limits 402 and 404 on the upper and lower surfaces of component 400 may be undesirable and need to be removed. To provide a final component that is aesthetically pleasing, excess material from at least the intermediate element, and in some cases the first and second elements, can also be removed. [00033] To ensure that the resulting component is aesthetically pleasing, the elements 410 and 412 can be finished before being coupled to the connecting element 420. For example, the elements 410 and 412 can be formed initially to have excess material ( for example, 0.2 mm of excess material), which can be removed to ensure the elements have smooth or continuous cosmetic surfaces. In some cases, however, the outer surfaces of elements 410 and 412 may not be completely finished prior to engagement with the connecting element. Instead, only some excess material can be removed from surfaces (eg most of the excess material, leaving only 0.05mm of excess material). The remaining excess material on the outer surfaces of the elements may need to be removed to finish the component. In particular, the first element 410 may include the excess material 411, 412 and the second element may include the excess material 413. The excess material may take any suitable shape, including, for example, slits, tool marks (by cold working), granular particles, bumps or bumps, or combinations thereof. Excess material can be located on any suitable surface of the elements, including, for example, in regions near or away from the interface with the intermediate element. [00034] If the first and second elements 410 and 412 are not finished, the combination of the first and second elements 410 and 412 with the intermediate element 420 can be processed to remove excess material and provide an aesthetically pleasing finish. This approach can limit the number of production steps required to manufacture the component, as a single finishing step can be used for the first and second elements 410, 412 and the intermediate element 420. Any suitable process can be used to simultaneously finish the elements. For example, a milling process or any other process can be applied to component 400 to remove excess material from all elements, including elements constructed from different materials. Other finishing processes can include, for example, machining, dropping, corroding, electroplating, anodizing, electropolishing, polishing, sandblasting, or combinations thereof. [00035] In some embodiments, the manufacturing process of one or more of the first element, second element, and intermediate element may intentionally leave excess material on the component (for example, as shown in figure 4). Using this approach, a single finishing process can be used for the entire component to ensure that the resulting component satisfies industrial design considerations. In particular, the final component (post-finishing process) may have a continuous surface between interfaces or gaps between component elements. [00036] Although the example of Figure 4 shows a flat or planar surface between the first and second elements and the intermediate element, it will be understood that a single process can be used to remove excess material from a surface of any suitable shape. . For example, a single process can be applied to a curved surface or a rounded surface. As another example, a single process can be applied to a surface that has one or more angular sections (for example, around the corners of a rectangular cross section). [00037] In some embodiments, a single finishing process can be applied universally to all elements (having correspondingly different material properties) in a component. For example, a single cutting tool can be applied to all elements. As another example, a single mill can be applied to component surfaces. Alternatively, several tools or mills can be applied to different component surfaces. For example, different tools can be applied to metal and plastic elements to explain differences in the mechanical properties of the elements. [00038] In some modalities, a single process or tool can be used for each of the elements. In some cases, the process or tool can be applied using a setting that matches a material property of one of the elements (eg softer material) to avoid staining or other damage to less resistant materials. Alternatively, a single process or tool can be used with different configurations. For example, a different force can be applied to a tool that operates on the component. As another example, a mill can rotate at different speeds, or be pressed against the component with different forces. The finishing process can be adjusted using any suitable approach. In some embodiments, the processing apparatus can include one or more sensors to detect the type of material being processed, and can adjust the way in which the material is processed based on the detected material. Alternatively, an operator can specify the material type of each element to be processed into an assembled component. The device can automatically adjust processing settings, or the user can manually change the settings. [00039] Figure 5 is a schematic view of an illustrative assembly for the removal of excess material from the front and rear surfaces of a connecting component constructed by several elements, according to an embodiment of the invention. Component 500 can be constructed by connecting first element 510 and second element 520 together using material 505 (which can form an intermediate element). In some embodiments, the excess material 505 may extend beyond the boundaries of the gap 508 between the first element 510 and the second element 520. In particular, the excess material 506 may extend beyond the front surface 511 of the first element. 510 and front surface 521 of second element 520, and excess material 507 may extend beyond rear surface 512 of first element 510 and onto rear surface 522 of second element 520. Excess material may adversely affect cosmetic appearance of component 500, and may, in some cases, in addition to or instead of compromising the structural integrity of the component (for example, introducing stress points). In some embodiments, the tool used to supply material 505 may prevent excess material from the extension from passing an interface along a particular plane (e.g., avoiding excess material 507). In such cases, fewer operations may be required to remove excess material and provide a cosmetically acceptable component. [00040] To remove excess material 506 and excess material 507, grinding or cutting tools 540 and 542 can be applied to the excess material. For example, cutting tool 540 may be displaced toward front surfaces 511 and 521 (e.g., for excess material 506) in direction 550. As another example, cutting tool 540 may substantially rest on one or both of them. the rear surfaces 512 and 522, and moving laterally along the surface in the direction 552 to remove excess material 507 extending beyond the surface level (e.g., removing gloss that seeps out of a mold slit during the molding process, where gloss is unwanted additional material of a molded element). In some embodiments, a single cutting tool can be used successively, on the front and back surfaces 510 and elements 520 (instead of or in addition to using both cutting tools 540 and 542, for example, at the same time ). [00041] In some embodiments, a process of grinding, cutting or other means for removing material can be applied to a component that has opposite side walls (for example, forming a circuit), such that material can be removed from the surfaces internal and external component at the same or different times. In particular, the process can be applied to a ring-shaped component (eg an outer periphery member as shown in figure 1). Figure 6 is a schematic view of an illustrative assembly for removing excess material from a closed ring component, in accordance with an embodiment of the invention. Component 600 can be constructed from discrete elements 610, 620 and 630 coupled together to form a ring. In particular, elements 610 and 620 can be coupled using intermediate element 605, elements 620 and 630 can be coupled using intermediate element 606, and elements 630 and 610 can be coupled using intermediate element 607. Elements 610 , 620 and 630 may each include a curved or angular section to allow the combined component to form a loop. Intermediate elements 605, 606 and 607 can be coupled to each of elements 610, 620 and 630 using any suitable approach including, for example, molding, brazing or other methods described above. In particular, the material(s) used for each of the intermediate elements 605, 606 and 607 can be selected to change from a first state in which it is placed between the elements to a second state in which it securely connects to the elements. Due to the fabrication approach used to connect the component elements, some parts of the intermediate elements 605, 606 and 607 may extend beyond desired boundaries or interfaces, and may need to be removed. In some cases, one or more of elements 610, 620 and 630 may instead or in addition include excess material that extends beyond one or more desired end surfaces of the elements. [00042] To remove excess material from one or more of the elements 610, 620 and 630, and the intermediate elements 605, 606, and 607, grinding or cutting tools 640 and 642 can be applied along the inner surfaces and external of component 600, for example, as described above in relation to Figure 5. Tools may move in any suitable direction, including, for example, perpendicular to a component surface, or tangent to a component surface (by example, following the form of component 600). Tools 640 and 642 can be applied at any suitable time, including, for example, simultaneously or sequentially (for example, in which case only a single tool can be used). The cutting tools can remove material from one or more elements used to construct components 600, including, for example, removing material from elements 610, 620 and 630, or material from intermediate elements, so that the resulting component has a smooth, continuous surface along the gaps or interfaces between the elements. [00043] Figure 7 is a flowchart of an illustrative process for finishing a component built from elements of different materials, according to an embodiment of the invention. Process 700 may begin at step 702. At step 704, the first and second elements may be provided. The first and second elements can be constructed from the same or different materials, or from materials that have the same or different properties (eg mechanical or manufacturing). For example, the first and second elements can be constructed from a metal (eg using cold working). At step 706, the first and second elements may be connected via an intermediate element. The intermediate element can be constructed from any suitable material, including, for example, a material selected such that at least two of the first, second and intermediate elements are constructed from materials with different properties. For example, the intermediate element can be constructed from plastic. The first and second elements can be bonded to the intermediate element using any suitable approach including, for example, using molding or brazing, as described above. In some cases, the intermediate member may be provided in a first state between the first and second elements and later change to a second state to create a structural bond between the first and second elements. In step 708, the first, second and intermediate elements can be processed using a single tool to define a uniform surface across the slits or interfaces between the elements. For example, a single tool or process can be applied to a plane or surface of a component that has an interface between different elements (for example, different tools can be used for different planes or surfaces, such as front and back surfaces, but only a single tool can be used for a particular plane or surface). In some cases, the first, second, and intermediate elements can be processed to create a desired final shape or surface property (eg, a shape driven by industrial design considerations). For example, a grinding or cutting tool can be applied to the elements to render a surface of the elements, and an interface between the elements. In some embodiments, tool settings can be adjusted for each element based on the material used for the element, or on the properties of the material used for the element. Process 700 may end at step 710. [00044] Figure 8 is a flowchart of an illustrative process for adjusting the settings of a finishing apparatus according to an embodiment of the invention. Process 800 may begin at step 802. At step 804, an electronic device component constructed from various elements of the components connected together can be placed in a finishing apparatus. The finishing apparatus can include, for example, a machine manufacturing process either that can provide an aesthetically pleasing finish to the component, or can remove excess material from the component. The elements of the individual components can be connected by any suitable method, including, for example, using the material properties of one of the elements of the components. For example, one of the component elements may change from a first state in which the component element flows between other constituent elements to a second state in which the component element structurally connects the other constituent elements to form an integral component. . At step 806, the apparatus can detect an element of the component that is placed in front of a tool of the finishing apparatus. For example, the apparatus can detect the particular portion of the component that will be processed by the apparatus. At step 808, the apparatus can identify the material of the detected component element. For example, the device can identify a material from a sensor (eg an optical sensor) used by the device. As another example, the apparatus can determine the particular region of the component, and retrieve a material from a user, from the component description (for example, the region corresponds to an element of the small component, which is known to be constructed from plastic intermediate element). As yet another example, a user can provide material information directly to the finishing device. In some embodiments, the apparatus may instead or in addition identify a particular material property that relates to the way in which the tool is applied to the component (eg, instead of or in addition to the actual material). [00045] In step 810, the instrument can select the settings for the instrument that correspond to the identified material. For example, the apparatus may select a particular tool, force, or other adjustment apparatus based on material. In particular, the amount of force applied to the component element can vary according to the material properties (eg, apply less force for a softer material) of the component element. In some embodiments, the apparatus may select an apparatus configuration that corresponds to the softest or least resistant material of the component element. At step 812, the apparatus can process the detected component element using the selected settings. For example, the apparatus can apply a tool to the component element with a force, at a speed to determine the apparatus settings. [00046] In step 814, the apparatus can determine if a new component element is detected. For example, the apparatus can determine, as a tool moves, whether the tool has reached a new component element. In some cases, the device may instead or in addition determine if new material has been detected. If the apparatus determines that a new component element has been detected, process 800 can move to step 808 and identify the material of the new component element. [00047] If, in step 814, instead of the apparatus does not detect a new element of the component, the process 800 can move to step 816. In step 816, the apparatus can determine whether the entire component has been finished in the apparatus of finishing. If the apparatus determines that the entire component is not yet finished, process 800 can return to step 812 and continue processing the current component element. If, at step 816, the apparatus instead determines that the component has been fully completed, process 800 may end at step 818. [00048] The modalities described above are presented for purposes of illustration and not limitation. It is understood that one or more features of one embodiment may be combined with one or more features of another embodiment to provide systems and/or methods without departing from the spirit and scope of the invention.
权利要求:
Claims (26) [0001] 1. A method for constructing an electronic device component having a continuous outer surface (101) extending through at least one seam between various elements of the electronic device component, characterized in that it comprises the steps of: connecting a first element (210, 302, 322, 410, 510) formed from a first metal material and defining a first portion of the continuous outer surface and a first opening (308, 408), and a second element (212, 304, 324, 412, 520 formed from a second metal material and defining a second portion of the continuous outer surface and a second opening (310, 330), together with an intermediate element (220, 306, 326, 420, 605 ) formed from an electrically insulating material and defining a third portion of the continuous outer surface, the intermediate element (220, 306, 326, 420, 605) molded between the first element (210, 302, 322, 410, 510) and the second eleme tion (212, 304, 324, 412, 520), the intermediate element (220, 306, 326, 420, 605) filling at least in part the first opening (308, 348) and the second opening (310, 330) for structurally connecting the first element (210, 302, 322, 410, 510) to the second element (212, 304, 324, 412, 520) and forming at least a portion of the continuous outer surface of the electronic device component, wherein the surface The continuous external element of the electronic device component comprises a first seam at an interface between the first element (210, 302, 322, 410, 510) and the intermediate element (220, 306, 326, 420, 605), and a second seam at an interface between the second element (212, 304, 324, 412, 520) and the intermediate element (220, 306, 326, 420, 605); and remove excess material (421, 422) from at least two of the first (210, 302, 322, 410, 510) and second (212, 304, 324, 412, 520) elements and the intermediate element ( 220, 306, 326, 420, 605) using a single process to form a continuous surface across at least one of a first seam and a second seam. [0002] 2. The method of claim 1, further comprising: grinding excess material (421, 422) away from at least two of the first element (210, 302, 322, 410, 510) , the second element (212, 304, 324, 412, 520) and the intermediate element (220, 306, 326, 420, 605). [0003] 3. Method according to claim 1, characterized in that it further comprises: applying a tool (640, 642) to the first element (210, 302, 322, 410, 510), the second element (212, 304) , 324, 412, 520 and the intermediate element (220, 306, 326, 420, 605) for removing excess material (421, 422) through one of the first seam and the second seam. [0004] 4. Method according to claim 1, characterized in that the intermediate element (220, 306, 326, 420, 605) electrically isolates the first element (210, 302, 322, 410, 510) from the second element ( 212, 304, 324, 412, 520). [0005] 5. Method according to claim 4, characterized in that the first element (210, 302, 322, 410, 510) forms at least part of an antenna electrically coupled to an electrical component disposed in the electronic device component. [0006] 6. Method according to claim 1, characterized in that: the first element (210, 302, 322, 410, 510) comprises a protrusion extending from an outer surface; and the intermediate element (220, 306, 326, 420, 605) is molded to the boss. [0007] 7. Method according to claim 6, characterized in that: the boss defines the first opening (308, 408). [0008] 8. Method for finishing a surface of an electronic device component constructed by connecting at least one metallic element and a plastic element, characterized in that it comprises the steps of: identifying at least one among the metallic element or the element plastic with which a tool (640, 642) is aligned, wherein the electronic device component comprises at least the metallic element and the plastic element connected at an interface, the metallic element and the plastic element structurally coupled together to form at least one surface of the electronic device component that is exposed to a user; detecting a material of the metallic element or plastic element; adjusting settings by controlling an operation of the tool (640, 642) based on the detected material; and operating the tool (640, 642) on the at least one of the identified metallic element or plastic element to form a continuous surface across the interface between at least the metallic element and the plastic element. [0009] 9. Method according to claim 8, characterized in that it further comprises: aligning the tool (640, 642) with another one of at least the metallic element or the plastic element; detecting that one material of the other among at least the metallic element or the plastic element; and adjusting the settings based on the detected material of the other among at least the metallic element or the plastic element. [0010] 10. Method according to claim 8, characterized in that: the at least two different materials comprise materials that have different manufacturing properties. [0011] 11. Method according to claim 10, characterized in that: the same tool (640, 642) is applied to each of the materials. [0012] 12. Method according to claim 8, characterized in that: the tool (640, 642) is operative to remove a material from each of the metallic element and the plastic element in regions of the metallic element and the element plastic adjacent to the interface. [0013] 13. Method according to claim 12, characterized in that: the tool (640, 642) has a mill. [0014] 14. Method according to claim 8, characterized in that the operation further comprises: forming a smooth flat surface across the interface. [0015] 15. Electronic device component, characterized in that it comprises: a first metal element (210, 302, 322, 410, 510) defining a first portion of an outer side wall of the electronic device component and a first opening (308 , 348); a second metal element (212, 304, 324, 412, 520) defining a second portion of the outer side wall of the electronic device component and a second opening (310, 330); and an insulating intermediate element (220, 306, 326, 420, 605) molded between and at least partially filling the first indentation (308, 348) in the first metal element (210, 302, 322, 410, 510) and the second setback (310, 330) in the second metal element (212, 304, 324, 412, 520), thereby structurally connecting the first metal element (210, 302, 322, 410, 510) and the second metal element (212, 304, 324, 412, 520), the insulating intermediate element (220, 306, 326, 420, 605) defining a third portion of the outer sidewall of the electronic device component. [0016] 16. Electronic device component according to claim 15, characterized in that: the first metal element (210, 302, 322, 410, 510) and the second metal element (212, 304, 324, 412 , 520) are cold worked. [0017] 17. The electronic device component of claim 15, characterized in that: the first, second and third portions of the outer side wall define a smooth, continuous outer surface of the electronic device component. [0018] 18. Electronic device component according to claim 17, characterized in that: the smooth, continuous outer surface defines a single plane. [0019] 19. Electronic device component according to claim 15, characterized in that: the insulating intermediate element (220, 306, 326, 420, 605) is injection molded. [0020] 20. Housing (100) for an electronic device, characterized in that the housing (100) comprises: a first conductive element (210, 302, 322, 410, 510) defining a first portion of an outer surface (101) of the casing (100) and a first opening (308, 348); a second conductive element (212, 304, 324, 412, 520) defining a second portion of the outer surface (101) of the casing (100) and a second opening (310 , 330); and an intermediate element (220, 306, 326, 420, 605) formed from a non-conductive material positioned at least partially between and molded to the first conductive element and the second conductive element, the intermediate element (220, 306, 326, 420, 605) occupying at least in part the first (308, 348) and second openings (310, 330), hereby connecting the first conductive element to the second conductive element and defining a third part of the outer surface (101) of the housing (100). [0021] 21. Housing according to claim 20, characterized in that: the intermediate element (220, 306, 326, 420, 605) electrically insulates the first conductive element from the second conductive element; and the intermediate element (220, 306, 326, 420, 605) allows the operation of an antenna of the electronic device. [0022] 22. Housing according to claim 20, characterized in that the first, second and third portions of the outer surface of the housing cooperate to define a smooth, continuous surface of an outer side wall of the housing. [0023] 23. Enclosure according to claim 20, characterized in that: the enclosure is configured to house a screen; and the first conductive element defines a U-shaped upper portion of the casing that extends across one side of the screen. [0024] 24. Housing according to claim 20, characterized in that: the intermediate element (220, 306, 326, 420, 605) includes an overflow portion that is molded at least partially on an internal surface of at least the first conductive element or the second conductive element. [0025] 25. Housing according to claim 20, characterized in that: the first conductive element comprises a first protrusion extending from a first inner surface of the first conductive element; the second conductive element comprises a second protrusion extending from a second inner surface of the second conductive element; and the first protrusion of the first conductive element and the second protrusion of the second conductive element are structurally engaged with the intermediate element (220, 306, 326, 420, 605). [0026] 26. Housing according to claim 25, characterized in that: the first protrusion on the first conductive element defines the first opening (308, 348); and the second protrusion on the second conductive member defines the second opening (310, 330).
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法律状态:
2020-09-08| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]| 2020-12-29| B07A| Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]| 2021-04-13| B09A| Decision: intention to grant [chapter 9.1 patent gazette]| 2021-06-15| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 24/09/2010, OBSERVADAS AS CONDICOES LEGAIS. PATENTE CONCEDIDA CONFORME ADI 5.529/DF |
优先权:
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申请号 | 申请日 | 专利标题 US30078010P| true| 2010-02-02|2010-02-02| US61/300,780|2010-02-02| US32562510P| true| 2010-04-19|2010-04-19| US32578610P| true| 2010-04-19|2010-04-19| US61/325,786|2010-04-19| US61/325,625|2010-04-19| US12/794,496|2010-06-04| US12/794,496|US9363905B2|2010-02-02|2010-06-04|Cosmetic co-removal of material for electronic device surfaces| PCT/US2010/050119|WO2011096959A1|2010-02-02|2010-09-24|Cosmetic co-removal of material for electronic device surfaces| 相关专利
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